Thesis Defense - S.Veghar Seyedmohammadi (MSME)

SeyedVeghar Seyedmohammadi - M.Sc. Mechanical Engineering

Assoc. Prof. Dr. Güney Güven Yapıcı – Advisor

Date: 18.08.2021

Time: 18:00

Location: This meeting will be held ONLINE. Please send an e-mail to gizem.bakir@ozyegin.edu.tr in order to participate in this defense.

Thermo-Mechanical Processing and Phase Transformation

Behavior of  Cu‑Al‑Mn Shape Memory Alloy

Thesis Committee:

Assoc. Prof. Dr. Güney Güven Yapici, Özyeğin University

    Assist. Prof. Dr. Altuğ Melik Başol, Özyeğin University

Assist. Prof. Dr. Mehmet İpekoglu, Turkish-German University

Abstract:

Cu-Al-Mn shape memory alloys have attracted noticeable interest between copper-based SMAs, due to the high ductility and wide transformation temperature range. The phase transformation temperatures and microstructure observation besides mechanical examination were done by considering the different re-melting times, rolling, and heat treatment conditions. It was found that one-time re-melt with VIM method and hot rolling followed by a solutionizing process is required to manufacture the SMA. Aging over Af temperature showed an increase in hardness value to 320 Hv, and loss of shape memory effect. These findings are caused by the generation of the γ precipitates phase after 480 minutes of aging at 400°C.  The SME behavior of the rolled samples was achieved by standard bending test about 90% which was decreased observed in aged samples

Bio: 

SeyedVeghar Seyedmohammadi was born in Tabriz, Iran. He completes the degree of high school in casting-metallurgical engineering. In June 2010 he received his AS degree in the field of casting-metallurgical engineering from technical university of Iran. In August 2013, he received his B.Sc. degree in metallurgical-metal melting engineering from Islamic Azad University, Ahar, Iran. In September 2017, he started working towards his MSc at MEMFIS group of Ozyegin University. His research interests mainly concentrate on the manufacturing process and thermo-machanical behavior of copper‑based shape memory alloys.